Supex Superbond 2000, PU panel bonding adhesive, is a solvent-free as well as a moisture curing . At room temperature and the required humidity in the joint sufficient strength will be obtained after approximately 10 to 15 minutes. It is cured in a heated press for faster curing. Maximum temperature must not exceed 70°C.
Application Areas of PU Panel Adhesive
Used for the manufacture of sandwich elements with porous surfaces (e.g. wood) which contain humidity. The surfaces can be bonded to one another or to metals, laminated panels, various plastics, rigid foams made of polystyrene, polyurethane as well as others.
PROPERTIES SUPER BOND 2000
- APPEARANCE Light viscous liquid
- COLOUR Straw to Brown
- ODOUR Slight odour Characteristic Musty (moulds).
- SOLUBILITY Insoluble in water reacts with water, Soluble in aromatic solvents
- S.G 1.1
- BOILING POINT (°C) >300
- VISCOSITY 7000-10000 cps 25°C
- FLASH POINT (°C) >200 (Closed cup)
- STORAGE STABILITY 8months
PU Panel Bonding Adhesive application procedure
Application Temperature : 10 to 35 °C.
Supex Superbond 2000, one part PU adhesive is applied to the surface by spatula or doctor blade. One can also apply by spraying or rolls. In case of bonding surfaces without sufficient humidity or which are not moisture permeable the required amount of moisture is provided by other methods. Moreover, a proven procedure is the combined spraying of the adhesive at the same time with water in a fine mist. Water is never sprayed onto the bare metal in the case of separate adhesive and water mist application. However, it is sprayed on the
other substrate or ideally on the adhesive. Bonding surfaces should be brought together immediately after adhesive application. This assures sufficient contact pressure while curing although preferably in a press.
Since Supex 2000 cures by reaction with humidity, open containers must always be properly sealed and protected against moisture immediately after taking out the quantity needed. For the same reason we recommend to use up opened containers as soon as possible.
- Material/ substrates to be bonded should be grease, dust and dirt free.
- Press the panel in the press at the minimum load 0.6 N/square mm for 30min for 70°C .
- period of between 1 to 4 hours will be required for good bonding dependent on the temperature and the nature of the materials to be bonded. Post curing it is ready for any kind of coating.
- should not be applied to wet surfaces (i.e. surfaces where there are visible signs of moisture such as obviously damp patches). This product requires water misting which results in a faster full cure.
COVERAGE: The usage rate of the material will be very dependent on the nature and porosity of the surfaces to be bonded. Good bonds can be achieved at a thickness between 500 to 1000 microns. When used on non-porous/plain substrates coverage will be 2-3m²/kg.
Cleaning: Fresh, uncured material (cleaning application equipment, substrate contamination etc.) can be removed with Supex cleaner; cured adhesive can only be removed mechanically.
Packaging: 30 Litres Drum